Hello Technetters,

We had an issue with cracked SMT ceramic capacitors causing boards to fail functional test. We isolated the problem to a reel of parts that contained some cracked caps and purged these. Problem solved.

My question is about what to do with boards built with these capacitors before we purged. The boards pass functional test. The concern is that a cracked cap was loaded, but has not yet failed. The range of actions proposed here are:

- Temperature cycle the boards between -5 C and 55 C a few times. The theory is that this will flush out any latent defects.

- Visually inspect for defects.

- Manually change out all the suspect caps, about 50 per board.

Does anyone have thoughts on what would be the best method or another idea? We don't have ICT capability.

Thanks!

Raye Rivera



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