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April 2011

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Subject:
From:
Luan Nguyen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Luan Nguyen <[log in to unmask]>
Date:
Thu, 7 Apr 2011 08:07:15 +0700
Content-Type:
text/plain
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text/plain (140 lines)
Thanks Mike,
The preheat is from Versa machine then go to soldering station. The
preheat includes TOP (hot air) and BOTTOM (halogen light).
Please advise.

Best regards,
Luan


>>> Mike Fenner <[log in to unmask]> 06-Apr-11 9:37 PM >>>
Where/How are you measuring preheat, topside or bottom side? A thick
board
with thermal plane will need good top side heat.

Regards
 
 
Mike
ΓΌ Please consider the environment before printing this e-mail

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Luan Nguyen
Sent: Wednesday, April 06, 2011 9:16 AM
To: [log in to unmask] 
Subject: [TN] Vertical solder fill for component with thermal pad.

Dear all,
Our company have a problem for insufficient solder for PTH (thermal
pad). It
means vertical solder fill is less than 75%. Would you please to advise
us
for some parameters of Versa machine, includes: flux spraying time,
Reheating temperature/time and soldering temperature/time.
Some further information in below
- Machine: ERSA Versaflow 40/50
- Component description: CAP,TANT,82UF,75V,10%,AXIAL (lead diameter
0.64 +/-
0.05 mm)
- PCB info: Hole diameter 1 +/- 0.07 mm, thickness 2.1336 mm, thermal
pad.
- Material: solder bar Kester, Flux 959
- Current conditions:
  + flux time: 5s
  + Preheat temp 140 C deg, time 180s
  + Soldering temp 275 C deg, time 4s

Thanks in advance.



***************************
Nguyen Hoang Luan
QA Supervisor - IPC Trainer
Spartronics VietNam Co, Ltd.
No.3, Street No.6, VSIP
Th An Dist., BDuong Prov., VN
Tel: (84-650) 784 890
Fax: (84-650) 784 891
Mobile: 090.3.667448
Email: [log in to unmask] 
***************************


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