Where/How are you measuring preheat, topside or bottom side? A thick board
with thermal plane will need good top side heat.
Regards
Mike
ü Please consider the environment before printing this e-mail
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Luan Nguyen
Sent: Wednesday, April 06, 2011 9:16 AM
To: [log in to unmask]
Subject: [TN] Vertical solder fill for component with thermal pad.
Dear all,
Our company have a problem for insufficient solder for PTH (thermal pad). It
means vertical solder fill is less than 75%. Would you please to advise us
for some parameters of Versa machine, includes: flux spraying time,
Reheating temperature/time and soldering temperature/time.
Some further information in below
- Machine: ERSA Versaflow 40/50
- Component description: CAP,TANT,82UF,75V,10%,AXIAL (lead diameter 0.64 +/-
0.05 mm)
- PCB info: Hole diameter 1 +/- 0.07 mm, thickness 2.1336 mm, thermal pad.
- Material: solder bar Kester, Flux 959
- Current conditions:
+ flux time: 5s
+ Preheat temp 140 C deg, time 180s
+ Soldering temp 275 C deg, time 4s
Thanks in advance.
***************************
Nguyen Hoang Luan
QA Supervisor - IPC Trainer
Spartronics VietNam Co, Ltd.
No.3, Street No.6, VSIP
Th An Dist., BDuong Prov., VN
Tel: (84-650) 784 890
Fax: (84-650) 784 891
Mobile: 090.3.667448
Email: [log in to unmask]
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