Doug: What you are asking, at root, is if CO2 will give you problems....
Consider that your plating tank is already saturated with CO2, and that even from the storage tank, the incoming water likely has LESS CO2 per liter than the plating tank..
Based on that, it is doubtful that you will see a difference.
Rudy Sedlak
RD Chemical Company
--- On Wed, 4/6/11, Douglas Pauls <[log in to unmask]> wrote:
From: Douglas Pauls <[log in to unmask]>
Subject: Re: [TN] [TechNet] DI water and plating
To: [log in to unmask]
Date: Wednesday, April 6, 2011, 5:32 AM
I am being vague on purpose.
Lets try this. Lets say I have two scenarios. In the first scenario, DI
water is generated at about 16 megohm-cm and is fed directly into the
plating tanks. Chemically clean and high resistivity. Second situation,
the DI water goes into a large holding tank (plastic) where the 16
megohm-cm water becomes 2 megohm-cm water just from sitting around, and
gets piped into the plating tank. Still clean chemically, but now has
lower resistivity from CO2 mixing. Lets say the tank is silver plating,
just for fun. Am I going to see any difference in plating between the two
scenarios, all other factors being equal, because one has lower
resistivity than the other?
Doug Pauls
Dennis Fritz <[log in to unmask]>
04/05/2011 08:08 PM
To
[log in to unmask], [log in to unmask]
cc
Subject
Re: [TechNet] DI water and plating
Hmm, Doug, I too must ask for some clarification for your question. All
electroplating baths I know have high concentrations of acids or highly
conductive salts, to the point that the bath should have essentially zero
resistance. The voltage registered when electroplating is that used to
reduce metallic ions to elemental metal, not to drive current through the
bath. That
This voltage is the basis of the electomotive scale or electromotive
force. It is always good to use DI water to make up an electroplating
bath, because some common anions - like chloride - need to be well
controlled. For instance in a sulfate copper electroplating bath, the
chloride acts as the "anode corroder" causing the metallic copper
electrode to be "etched" with a film of cupric chloride and go into
solution.
Are you thinking about the rinse water after plating?
Denny
-----Original Message-----
From: Douglas Pauls <[log in to unmask]>
To: TechNet <[log in to unmask]>
Sent: Tue, Apr 5, 2011 12:04 pm
Subject: [TechNet] DI water and plating
Good morning all. I have a general question for those of you who deal
with electroplating. How critical is the resistivity of the water to the
plating process? I am not talking about impurities in the water, only the
resistivity of it?
Doug Pauls
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