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April 2011

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Wed, 6 Apr 2011 04:52:28 -0400
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Did you talk to kester?
--------------------------
Sent using BlackBerry


----- Original Message -----
From: Luan Nguyen [mailto:[log in to unmask]]
Sent: Wednesday, April 06, 2011 04:16 AM
To: [log in to unmask] <[log in to unmask]>
Subject: [TN] Vertical solder fill for component with thermal pad.

Dear all,
Our company have a problem for insufficient solder for PTH (thermal pad). It means vertical solder fill is less than 75%. Would you please to advise us for some parameters of Versa machine, includes: flux spraying time, Reheating temperature/time and soldering temperature/time.
Some further information in below
- Machine: ERSA Versaflow 40/50
- Component description: CAP,TANT,82UF,75V,10%,AXIAL (lead diameter 0.64 +/- 0.05 mm)
- PCB info: Hole diameter 1 +/- 0.07 mm, thickness 2.1336 mm, thermal pad.
- Material: solder bar Kester, Flux 959
- Current conditions:
  + flux time: 5s
  + Preheat temp 140 C deg, time 180s
  + Soldering temp 275 C deg, time 4s

Thanks in advance.



***************************
Nguyen Hoang Luan
QA Supervisor - IPC Trainer
Spartronics VietNam Co, Ltd.
No.3, Street No.6, VSIP
Th An Dist., BDuong Prov., VN
Tel: (84-650) 784 890
Fax: (84-650) 784 891
Mobile: 090.3.667448
Email: [log in to unmask]
***************************


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