Doug, you mean Eh-Ph diagram? Yes, it is very important as to my limited understanding.
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----- Original Message -----
From: Dennis Fritz [mailto:[log in to unmask]]
Sent: Tuesday, April 05, 2011 09:08 PM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] [TechNet] DI water and plating
Hmm, Doug, I too must ask for some clarification for your question. All electroplating baths I know have high concentrations of acids or highly conductive salts, to the point that the bath should have essentially zero resistance. The voltage registered when electroplating is that used to reduce metallic ions to elemental metal, not to drive current through the bath. That
This voltage is the basis of the electomotive scale or electromotive force. It is always good to use DI water to make up an electroplating bath, because some common anions - like chloride - need to be well controlled. For instance in a sulfate copper electroplating bath, the chloride acts as the "anode corroder" causing the metallic copper electrode to be "etched" with a film of cupric chloride and go into solution.
Are you thinking about the rinse water after plating?
Denny
-----Original Message-----
From: Douglas Pauls <[log in to unmask]>
To: TechNet <[log in to unmask]>
Sent: Tue, Apr 5, 2011 12:04 pm
Subject: [TechNet] DI water and plating
Good morning all. I have a general question for those of you who deal
ith electroplating. How critical is the resistivity of the water to the
lating process? I am not talking about impurities in the water, only the
esistivity of it?
Doug Pauls
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