Gilbert

I am giving a paper at Apex that goes after this problem.


Best regards
Lee
J. L. Parker, Ph D
JLP Consultants, LLC
804 779 3389



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gilbert Min
Sent: Tuesday, April 05, 2011 8:52 PM
To: [log in to unmask]
Subject: [TN] Peel strength Value

Dear Netters.

I got a defect from customer for peel off problem. Defect was observed
between Cu foil and epoxy material.
I can not find true root cause yet.
And I tried to do the peel strength Test with defective boards.
Test codition: Cu plating thickness 32um. Length 2.3cm. Trace width : 253um
Peel strength Value: 0.11 kg.f Normal boards: 0.11 / 0.10 / 0.11/0.10 Defect
boards:  0.10 / 0.10 / 0.11 I'm not sure that is these value acceptable?

I know different test condition for peel strength. But I would like to know
any possiblity to do Peel strength test with actual sample not test
specimen..
And How can I convert these test value to normal test condition or value?

Would you share your wisdom to me?
Thanks

--
Best Regards
*GIlbert*


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