Dear Netters.

I got a defect from customer for peel off problem. Defect was observed
between Cu foil and epoxy material.
I can not find true root cause yet.
And I tried to do the peel strength Test with defective boards.
Test codition: Cu plating thickness 32um. Length 2.3cm. Trace width : 253um
Peel strength Value: 0.11 kg.f
Normal boards: 0.11 / 0.10 / 0.11/0.10
Defect boards:  0.10 / 0.10 / 0.11
I'm not sure that is these value acceptable?

I know different test condition for peel strength. But I would like to know
any possiblity to do Peel strength test with actual sample not test
specimen..
And How can I convert these test value to normal test condition or value?

Would you share your wisdom to me?
Thanks

-- 
Best Regards
*GIlbert*


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