Nope, I didn't. George is co-writer in one of the books. Of course, I have
his own book, but his work is limited to test methods and less pointing at
the wide area of various processing, failure modes, materials , packages,
chips, wafers and design.
Inge
On 29 April 2011 13:30, Thayer, Wayne - IIW <[log in to unmask]> wrote:
> Hey! You left out my favorite: Wirebonding in Microelectronics by George
> Harman!
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
> Sent: Thursday, April 28, 2011 3:51 PM
> To: [log in to unmask]
> Subject: Re: [TN] Die bonding requirements
>
> Hi "X",
>
> It depends....do you mean wire bonding on chip or bonding chips on
> something, e.g. a substrate? Anyway, this game seems simple, but is a
> science of its own. Few good standards, few gurus like splendid bonding
> professor Creswick.
>
> First of all, I recommend that you get a good book in this disciplin. I use
> the following ones, try to see if you can get any of them:
>
> 1. Chip On Board technologies for multichip modules. 500 pages with bonding
> technologies.
> John H. Lau / Von Nostrand Reinhold, 115 Fifth Avenue, New York, NY 10003
> ISBN 0-442-01441-4
>
> 2.Hybrid Microcircuit Technology Handbook. 450 pages of processing/ James
> J.
> Licari/ Noyes Publications, Mill Road at Grande Ave, Park Ridge, New
> Jersey.
>
> 3.Multichip Module Technology Handbook. 700 pages with lots of processing
> parameters/ Iwon Turlik, McGraw-Hill ISBN 0-07-022894-9
>
> 4.Microelectronics Packaging Handbook. 1,100 pages covering pretty well
> what
> you need. 50 co-writers from IBM / Rao R. Tummala, Van Nostrand Reinhold,
> ISBN 0-442-20578-3
>
> So, again, it depends on what you want to know more specifically.
>
>
> Inge
>
>
>
>
> On 28 April 2011 15:27, Victor Hernandez <[log in to unmask]
> >wrote:
>
> > Fellow TechNetters:
> >
> > Where can I find die bonding requirement. I am not familiar if IPC
> > address these issues/concerns. The same goes for die cutting anomalies.
> >
> > "X"
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
> > Sent: Thursday, April 28, 2011 7:42 AM
> > To: [log in to unmask]
> > Subject: Re: [TN] Mixed bed resin in deionizing tanks
> >
> > Morning? Have done a day's work already! DI works best at cold. The
> > normal resins are recommended at <50°C but are ok up to ~75°C, but less
> > efficient. Hot-water resins just have a different plastic matrix which I
> > surmise cannot be as good as 'normal' resins, otherwise there would be
> > no raison d'ętre for the latter. Many have a heat exchanger, so that the
> > hot water from the tank reheats the cooler water having passed through
> > the resin columns, thus saving energy.
> >
> > Brian
> >
> > On 28/04/2011 15:28, Steve Gregory wrote:
> > > Morning all,
> > >
> > >
> > >
> > > I have a question about the resin beads inside a mixed bed deionizing
> > tank.
> > > I know they're called cation and anion resin beads, but I don't know
> much
> > > about the physical properties of them.
> > >
> > >
> > >
> > > We have a carbon bed tank and a hot mixed bed tank to deionize the
> water
> > for
> > > our inline cleaner. I run the wash tank at 130 F., but I know the water
> > will
> > > cool a little before it gets to the mixed bed. We were asked when we
> > first
> > > had the DI system installed what temperature we would be running our
> wash
> > > at, and we told them 130 F., they said that we would need a hot mixed
> > bed.
> > >
> > >
> > >
> > > Okay, so we need a hot mixed bed, but what is the real difference in
> the
> > > resin beads between a standard mixed bed and a "hot" mixed bed?
> > >
> > >
> > >
> > > What happens when you run 130 F. water through a mixed bed that doesn't
> > have
> > > "hot" resin beads? Do they swell up, or break down? Or is it that just
> > the
> > > quality of the DI water will be affected?
> > >
> > >
> > >
> > > Steve
> > >
> > >
> > >
> > >
> > >
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