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April 2011

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From:
"Thayer, Wayne - IIW" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Thayer, Wayne - IIW
Date:
Fri, 29 Apr 2011 07:30:26 -0400
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Hey!  You left out my favorite: Wirebonding in Microelectronics by George Harman!

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
Sent: Thursday, April 28, 2011 3:51 PM
To: [log in to unmask]
Subject: Re: [TN] Die bonding requirements

Hi "X",

It depends....do you mean  wire bonding on chip or bonding chips on
something, e.g. a substrate? Anyway, this game seems simple, but is a
science of its own. Few good standards, few gurus like splendid bonding
professor Creswick.

First of all, I recommend that you get a good book in this disciplin. I use
the following ones, try to see if  you can get any of them:

1. Chip On Board technologies for multichip modules. 500 pages with bonding
technologies.
John H. Lau / Von Nostrand Reinhold, 115 Fifth Avenue, New York, NY 10003
ISBN 0-442-01441-4

2.Hybrid Microcircuit Technology Handbook. 450 pages of processing/ James J.
Licari/ Noyes Publications, Mill Road at Grande Ave, Park Ridge, New Jersey.

3.Multichip Module Technology Handbook. 700 pages with lots of processing
parameters/ Iwon Turlik, McGraw-Hill ISBN 0-07-022894-9

4.Microelectronics Packaging Handbook. 1,100 pages covering pretty well what
you need. 50 co-writers from IBM / Rao R. Tummala, Van Nostrand Reinhold,
ISBN 0-442-20578-3

So, again, it depends on what you want to know more specifically.


Inge




On 28 April 2011 15:27, Victor Hernandez <[log in to unmask]>wrote:

> Fellow TechNetters:
>
>   Where can I find die bonding requirement.   I am not familiar if IPC
> address these issues/concerns.   The same goes for die cutting anomalies.
>
> "X"
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
> Sent: Thursday, April 28, 2011 7:42 AM
> To: [log in to unmask]
> Subject: Re: [TN] Mixed bed resin in deionizing tanks
>
> Morning? Have done a day's work already! DI works best at cold. The
> normal resins are recommended at <50°C but are ok up to ~75°C, but less
> efficient. Hot-water resins just have a different plastic matrix which I
> surmise cannot be as good as 'normal' resins, otherwise there would be
> no raison d'ętre for the latter. Many have a heat exchanger, so that the
> hot water from the tank reheats the cooler water having passed through
> the resin columns, thus saving energy.
>
> Brian
>
> On 28/04/2011 15:28, Steve Gregory wrote:
> > Morning all,
> >
> >
> >
> > I have a question about the resin beads inside a mixed bed deionizing
> tank.
> > I know they're called cation and anion resin beads, but I don't know much
> > about the physical properties of them.
> >
> >
> >
> > We have a carbon bed tank and a hot mixed bed tank to deionize the water
> for
> > our inline cleaner. I run the wash tank at 130 F., but I know the water
> will
> > cool a little before it gets to the mixed bed. We were asked when we
> first
> > had the DI system installed what temperature we would be running our wash
> > at, and we told them 130 F., they said that we would need a hot mixed
> bed.
> >
> >
> >
> > Okay, so we need a hot mixed bed, but what is the real difference in the
> > resin beads between a standard mixed bed and a "hot" mixed bed?
> >
> >
> >
> > What happens when you run 130 F. water through a mixed bed that doesn't
> have
> > "hot" resin beads? Do they swell up, or break down? Or is it that just
> the
> > quality of the DI water will be affected?
> >
> >
> >
> > Steve
> >
> >
> >
> >
> >
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