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April 2011

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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 28 Apr 2011 06:55:04 -0500
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Inge/Kelly,

   I do hope we do get a resolution on this concern as we have observed the same on gold finger and finger pointing about correct magnification to use or not to use.   If an anomaly is going to cause a defect one should use all magnification available to that analyst to photo document it, especially during a QUAL/evaluation of product in a laboratory environment.

   Please keep me posted.

"X"

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kelly Morris
Sent: Wednesday, April 27, 2011 10:55 AM
To: [log in to unmask]
Subject: Re: [TN] IPC-A-610, Solder on gold fingers - Inspection/Acceptability

Inge:
Thank you for your input and the information from Puligandla Viswanadham's book " Failure Modes and
Mechanisms in Electronic Packages.
I will dig into this.

Kelly

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