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April 2011

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Subject:
Re: Immersion/Electroless Palladium as final finish?
From:
Reuven Rokah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Reuven Rokah <[log in to unmask]>
Date:
Thu, 21 Apr 2011 20:59:16 +0300
Content-Type:
text/plain
Parts/Attachments:
text/plain (103 lines) 
Why do you need Pd with dissolution rate close to Ni and far away from Sn,
Au, Ag and Cu? you will need more thermal energy for the soldering process.

Reuven

On Thu, Apr 21, 2011 at 7:10 PM, R Sedlak <[log in to unmask]> wrote:

> Kimberly:
> I believe we are the only company supplying an Immersion Palladium plating
> system.
> This system is a true immersion Palladium, and plates only on bare Copper.
> It is not ENEPIG.   It has had limited use, and great results, and has been
> shown to maintain solderability for years.   By comparison to ENEPIG is is
> extremely inexpensive, and is ridiculously easy to maintain.
> If you send me a a street address, I would be pleased to send you a
> brochure on the system.
> Regards,
> Rudy Sedlak
>
> --- On Wed, 4/20/11, Kimberly Stanley <[log in to unmask]> wrote:
>
> From: Kimberly Stanley <[log in to unmask]>
> Subject: [TN] Immersion/Electroless Palladium as final finish?
> To: [log in to unmask]
> Date: Wednesday, April 20, 2011, 1:13 PM
>
> Hi all.
> Has anyone heard of using immersion or electroless palladium as a
> replacement for an ENIG or electroplated nickel/gold final finish? I've been
> asked to research it but I'm having trouble finding any information. I've
> only heard of palladium being used as a component of an ENEPIG finish.
> Thanks,
> Kim
>
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-- 

Best Regards,

*Reuven Rokah*

Mobile: 972-52-60-120-18
Tele-fax: 97239360688
<http://www.rokah-technologies.com/>[log in to unmask]
[log in to unmask]
www.rokah-technologies.com

**


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