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April 2011

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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 20 Apr 2011 15:28:08 -0500
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Hi Kim - the IPC 4-14 committee is working on pulling together a 
specification on ENEPIG for inclusion in the IPC-455X series. If you go 
out to the IPC website and look under the 4-14 committee page, there is 
some very useful information on ENEPIG as a pwb finish. The ENEPIG finish 
is capable of both wirebonding and soldering so it is sometimes called the 
"universal" pwb finish. A number of companies are successfully using the 
finish on a wide range of products today. One word of caution - you can 
have an issue with palladium embrittlement, similar to gold embrittlement, 
of solder joints if you don't have an adequate soldering process and/or 
specify the correct Pd thickness.

Dave Hillman
Rockwell Collins
[log in to unmask]




Kimberly Stanley <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
04/20/2011 03:13 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Kimberly Stanley <[log in to unmask]>


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Subject
[TN] Immersion/Electroless Palladium as final finish?






Hi all.
Has anyone heard of using immersion or electroless palladium as a 
replacement for an ENIG or electroplated nickel/gold final finish? I've 
been asked to research it but I'm having trouble finding any information. 
I've only heard of palladium being used as a component of an ENEPIG 
finish.
Thanks,
Kim

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