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| Date: | Wed, 6 Apr 2011 15:15:07 -0400 |
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Hi Victor,
That will depend on the components as well as on the basis/purpose for the suggestions.
Certainly, IPC-7351B is a good source of information, but the land patterns for chip components that are reflow soldered rather than wave soldered with Pb-free solders are sub-optimum in terms of solder joint reliabiity, component cracking as well tombstoning resistance.
You may want to wait for the May issue of Global SMT & Packaging magazine where I will be discussing this issue in greater detail.
Werner
-----Original Message-----
From: Victor Hernandez <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Apr 6, 2011 2:30 pm
Subject: [TN] Surface Mount technology, Rectangular passive components (mostly resistors and capacitors):
Fellow TechNetters:
Where can I acquire a good source for components dimensions, size, versus PWB
copper pad foot print suggested dimensions?
"x"
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Linda Langley
Sent: Wednesday, April 06, 2011 12:18 PM
To: [log in to unmask]
Subject: [TN] NESTING
Technetters
I have a customer asking for re-work of components not populated on the
assembly, they do not want the component affixed to the board. The term
NESTING off to the side has been requested.
Anyone have any information they could share about Nesting ,what does it
mean and any methods for doing the process.
Linda Langley CIT
Training Specialist
Jabil Circuit
248-292-6176
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