 
| Sender: |
|
| X-To: |
|
| Date: |
Thu, 28 Apr 2011 11:13:23 -0400 |
| Reply-To: |
|
| Message-ID: |
|
| Subject: |
|
| From: |
|
| Content-Transfer-Encoding: |
quoted-printable |
| In-Reply-To: |
|
| Content-Type: |
text/plain; charset="UTF-8" |
| MIME-Version: |
1.0 |
| Parts/Attachments: |
|
|
Victor,
You could start with the old Mil-Std 883 and the following test methods. IPC likely has equivalents as well, but I don't remember them as readily.
TM 2010 - Internal visual monolithic
TM 2017 - Internal visual hybrid
TM 2019 - Die Shear
However, first, with a firm of your size, I would look internally. I'm sure you have all the information you need there - somewhere...
Relative to visual criteria for die attachment and dicing - Most of us in the hybrid industry took the Mil Std as the ABSOLUTE MINIMUM requirement. If we were to ever approach the limitations of the Mil Std, it generically meant that something was royally messed up and one should be VERY concerned.
Visual criteria can also be significantly different within the same facility for Mil, Space, Implantable medical, Automotive, Commercial, etc., so you need to know what product type you are seeking to glean info on/for.
Steve Creswick
http://www.linkedin.com/in/stevencreswick
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Thursday, April 28, 2011 9:28 AM
To: [log in to unmask]
Subject: [TN] Die bonding requirements
Fellow TechNetters:
Where can I find die bonding requirement. I am not familiar if IPC address these issues/concerns. The same goes for die cutting anomalies.
"X"
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|
