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March 2011

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Subject:
From:
vladimir Igoshev <[log in to unmask]>
Reply To:
Date:
Thu, 10 Mar 2011 22:36:57 +0000
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Werner,

If you take a look at C4s of large (around 1") ASICs in  section you'll see the corner "balls" tilted towards each other. 
Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

-----Original Message-----
From: Werner Engelmaier <[log in to unmask]>
Date: Thu, 10 Mar 2011 17:31:49 
To: <[log in to unmask]>; <[log in to unmask]>
Subject: Re: [TN] CCGAs vs BGAs


 Please explain that.
Werner

 


 

 

-----Original Message-----
From: vladimir Igoshev <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; Werner Engelmaier <[log in to unmask]>
Sent: Thu, Mar 10, 2011 4:10 pm
Subject: Re: [TN] CCGAs vs BGAs


And in large packages they can be "bent" (at room temperature"  by design to 

accommodate for CTE difference at higher temperatures.

Vladimir



SENTEC Testing Laboratory Inc.

11 Canadian Road, Unit 7.

Scarborough, ON M1R 5G1

Tel: (416) 899-1882

Fax: (905) 882-8812

www.sentec.ca



-----Original Message-----

From: Werner Engelmaier <[log in to unmask]>

Sender: TechNet <[log in to unmask]>

Date:         Thu, 10 Mar 2011 15:27:54 

To: <[log in to unmask]>

Reply-To: TechNet E-Mail Forum <[log in to unmask]>,

        Werner Engelmaier <[log in to unmask]>

Subject: Re: [TN] CCGAs vs BGAs



 Hi Ioan,

What they told you, "if the columns are bent more than 10 degrees, they end up 

with plastic deformations, which affects long term reliability" is a Red 

Herring. YES, you get plastic deformation, and YES, you have problems if you do 

not straighten the columns out prior to placement, BUT NO, you do NOT affect 

long-term-reliability.  It is ONE cycle of many to come.

Werner



 





 



 



-----Original Message-----

From: Ioan Tempea <[log in to unmask]>

To: [log in to unmask]

Sent: Thu, Mar 10, 2011 3:12 pm

Subject: Re: [TN] CCGAs vs BGAs





Phil,







I have only assembled them once, in a previous life, and I can tell you one 



thing: you have to make sure all the assembly chain (starting with Incoming and 



ending with Packing) be advised about what these components are.







I have learned this when getting a call from the Stores telling me those new 



components had a problem, the pins being too soft. Besides the fact they were 



coming from the customer and they had been removed from the original trays only 



to be shipped in a square box, it turned out (after calling Intel) that if the 



columns are bent more than 10 degrees, they end up with plastic deformations, 



which affects long term reliability. So we had to scrap a few parts costing $900 





each...







They solder well, if solder volume is per manufacturer's specification, but the 



placement machine vision systems will have a problem with the white ceramic 



body. If you can, specify dark body.







Good luck,







Ioan Tempea, ing.



Ingénieur Principal de Fabrication / Senior Manufacturing Engineer



T | 450.967.7100 ext.244



E | [log in to unmask] 



W | www.digico.cc







N'imprimer que si nécessaire - Print only if you must







-----Original Message-----



From: Phil Bavaro <[log in to unmask]>



To: [log in to unmask]



Sent: Thu, Mar 10, 2011 1:23 pm



Subject: [TN] CCGAs vs BGAs











Are there a lot of Technet folks using Ceramic Column Grid Arrays?















 















Somehow I have managed to dodge that bullet until now.  In the telecom







arena, my impression was it was better to keep my designs limited to







BGAs but I suspect that things might have changed now that I am dealing







with hi-rel designs.















 















Any advice is appreciated.















 















Phil























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