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March 2011

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Thu, 10 Mar 2011 15:27:54 -0500
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 Hi Ioan,
What they told you, "if the columns are bent more than 10 degrees, they end up with plastic deformations, which affects long term reliability" is a Red Herring. YES, you get plastic deformation, and YES, you have problems if you do not straighten the columns out prior to placement, BUT NO, you do NOT affect long-term-reliability.  It is ONE cycle of many to come.
Werner

 


 

 

-----Original Message-----
From: Ioan Tempea <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, Mar 10, 2011 3:12 pm
Subject: Re: [TN] CCGAs vs BGAs


Phil,



I have only assembled them once, in a previous life, and I can tell you one 

thing: you have to make sure all the assembly chain (starting with Incoming and 

ending with Packing) be advised about what these components are.



I have learned this when getting a call from the Stores telling me those new 

components had a problem, the pins being too soft. Besides the fact they were 

coming from the customer and they had been removed from the original trays only 

to be shipped in a square box, it turned out (after calling Intel) that if the 

columns are bent more than 10 degrees, they end up with plastic deformations, 

which affects long term reliability. So we had to scrap a few parts costing $900 

each...



They solder well, if solder volume is per manufacturer's specification, but the 

placement machine vision systems will have a problem with the white ceramic 

body. If you can, specify dark body.



Good luck,



Ioan Tempea, ing.

Ingénieur Principal de Fabrication / Senior Manufacturing Engineer

T | 450.967.7100 ext.244

E | [log in to unmask] 

W | www.digico.cc



N'imprimer que si nécessaire - Print only if you must



-----Original Message-----

From: Phil Bavaro <[log in to unmask]>

To: [log in to unmask]

Sent: Thu, Mar 10, 2011 1:23 pm

Subject: [TN] CCGAs vs BGAs





Are there a lot of Technet folks using Ceramic Column Grid Arrays?







 







Somehow I have managed to dodge that bullet until now.  In the telecom



arena, my impression was it was better to keep my designs limited to



BGAs but I suspect that things might have changed now that I am dealing



with hi-rel designs.







 







Any advice is appreciated.







 







Phil











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