You get a newer copy of the J002 than this one?  This was a ballot copy from last revision, and now a new revision is about done. We are not supposed to send out ballot copies, but this will get you started until you buy a copy from the IPC - see their web page. 

Denny






-----Original Message-----
From: jonathan noquil <[log in to unmask]>
To: Dennis Fritz <[log in to unmask]>
Cc: TechNet <[log in to unmask]>
Sent: Wed, Mar 2, 2011 9:06 am
Subject: Re: [TN] Solderability of Matte Sn Finish Package



Hi All
Yes we measured the Sn plating thickness by crossection and both packages seems to be at 10-13 microns (within specs).
The package is QFNX supplier vs superSo-8 from Xsupplier. Both are QFNs
The Superso-8 part almost soldered very well but QFX has almost 90 % voids.
They are soldered side by side using the same conditions as to reflow and paste.

Is there a compatibility issue with this?

Is the annealing process can affect the solderability when the Sn grain structure seems to be crystallized?

Maybe the other part (SuperSO-8) dont anneal the Sn plating and the other QFN anneal it?
We look at the surface comparing by SEM and they are different. The good solderability has compact grain structure and the bad one seems to be crystallizing.

Where can i get J-002?

thanks All





On Mon, Feb 28, 2011 at 10:26 AM, Dennis Fritz <[log in to unmask]> wrote:

Jonathan - 
 
Your problem is exactly why IPC Standard J-002 was developed.  Using this standard enables you to quantify, before you mount components and have to rework, how much difference there is in solderability   Sounds like your assembly conditions are a very sensitive test for tin plating!!
 
Denny Fritz






-----Original Message-----
From: jonathan noquil <[log in to unmask]>
To: TechNet <[log in to unmask]>
Sent: Mon, Feb 28, 2011 8:45 am
Subject: [TN] Solderability of Matte Sn Finish Package



Hi All
I noticed that there are differences in the solderability of two packages
ounted on the same board side by side with each other
sing the same reflow profile and paste.
The first package has almost less than 5 % voids of the total area and the
ther package has almost 90 % voiding.
Would there be an effect of the Sn plating quality to the solderability of
hese packages? What are the factors affecting Sn plating quality?
Thanks

_____________________________________________________________________
his email has been scanned by the MessageLabs Email Security System.
or more information please contact helpdesk at x2960 or [log in to unmask] 
_____________________________________________________________________
---------------------------------------------------
echnet Mail List provided as a service by IPC using LISTSERV 15.0
o unsubscribe, send a message to [log in to unmask] with following text in
he BODY (NOT the subject field): SIGNOFF Technet
o temporarily halt or (re-start) delivery of Technet send e-mail to 
[log in to unmask]: SET Technet NOMAIL or (MAIL)
o receive ONE mailing per day of all the posts: send e-mail to 
[log in to unmask]: SET Technet Digest
earch the archives of previous posts at: http://listserv.ipc.org/archives
lease visit IPC web site http://www.ipc.org/ContentPage.aspx?Pageid=E-mail-Forums 
or additional information, or contact Keach Sasamori at [log in to unmask] or 
47-615-7100 ext.2815
----------------------------------------------------





______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/ContentPage.aspx?Pageid=E-mail-Forums for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------