Has anyone been able to approve the patented Gel-Pak containers for
packaging of ESD sensitive items?

 

I found a supplier putting ESD sensitive ICs into these after tinning
and lead forming, and I cannot see how this is not a bad thing.

 

I realize the outer packaging is made from ESD approved materials, but
the Gel-Pak itself is fully insulative wrt surface/volume resistivity.

 

On the other hand, I see that one of the advertised uses for the Gel-Pak
is wafer/die packaging.

 

I could understand perhaps if the Gel-Pak loading and unloading was
performed under forced air ionizers, but in any other situation, I see
components leads and a sticky 1014 insulator as being the definition of
an ESD event.

 

I am also concerned about putting solderable surfaces onto the
"proprietary" Gel-Pak material since I don't know what it is.

  

 

Phil

 

 


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