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March 2011

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Subject:
From:
Inge Hernefjord <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Inge Hernefjord <[log in to unmask]>
Date:
Thu, 3 Mar 2011 13:29:36 -0800
Content-Type:
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text/plain (130 lines)
http://en.wikipedia.org/wiki/Polyoxymethylene

also named Delrin or POM.  You can get a extremly ion free from Hoechst, at
least when we bought from them 10 years ago.

Inge




On 3 March 2011 11:33, Douglas Pauls <[log in to unmask]> wrote:

> Steve,
> You might take a look at Henkel's MacroMelt material.  Made for
> electronics.
>
> Doug Pauls
>
>
>
> Steven Creswick <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 03/03/2011 01:13 PM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> Steven Creswick <[log in to unmask]>
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> [TN] Semiconductor Molding Compounds
>
>
>
>
>
>
> Dear Techsters,
>
> I have a question that I could use some input on.  I realize that it may
> be
> a bit off the wall for this forum but there are a lot of different folks
> out
> there.
>
> Traditional IC molding compounds are thermoset in nature.  Companies like
> Sumitomo, Nitto Denko, and Hysol-Henkel are major players.
>
> What about for an application where the requirements are not as extreme,
> no
> soldering, and mechanical device protection is more important?  There are
> glass fiber filled thermoplastics that will withstand the potential use
> environment, but are there any which are ionically clean enough and filled
> in such a manner [silica vs glass fiber, etc] that they can be used with
> thermoplastic injection equipment to overmold a chip and wire combo?
>
> Names and numbers would be helpful
>
> Inquiring minds sometimes ask silly questions
>
>
> Steve Creswick
> http://www.linkedin.com/in/stevencreswick
>
>
>
>
>
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