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| Date: | Wed, 2 Mar 2011 15:11:14 -0500 |
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Some of the new POPs don't have pads on the top surface but sunken balls, makes the spacing between the two pieces a tad tight.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Wednesday, March 02, 2011 2:35 PM
To: [log in to unmask]
Subject: Re: [TN] POP THE QUESTION??
Chris, Mike, Bev -
Are you speaking of something other than stacking compatible flip chips or
BGA's?
Those would seem easy by using a no-flow underfill, or a post applied
underfill [assuming size reduction with each step].
Give this ol' microelectronics geek a clue.
Steve Creswick
http://www.linkedin.com/in/stevencreswick
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