Hi Steve,

FCs and BGAs are what I was referring to. I would say the original
question wasn't whether it was easy, but what the potential problems
could be. Placing 0603s is easy, but that doesn't mean problems
can't/won't happen.


Best,
Mike

Mike Buetow
Circuits Assembly
w/m 617-327-4702

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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Wednesday, March 02, 2011 2:35 PM
To: [log in to unmask]
Subject: Re: [TN] POP THE QUESTION??

Chris, Mike, Bev - 

Are you speaking of something other than stacking compatible flip chips
or
BGA's?  

Those would seem easy by using a no-flow underfill, or a post applied
underfill [assuming size reduction with each step].

Give this ol' microelectronics geek a clue.


Steve Creswick
http://www.linkedin.com/in/stevencreswick





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