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| Date: | Tue, 29 Mar 2011 11:56:32 -0400 |
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If it is the conformal coat then underfilling before coating might work with minimal manufacturing disruption (although proper application of an underfill is not easy). I've done that with many of our SMT assemblies to make them robust.
Wayne
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dale Hart
Sent: Tuesday, March 29, 2011 8:35 AM
To: [log in to unmask]
Subject: [TN] Solder joint height control
The component sizes are 2012 or 1310 chip components. Actually I expected some
of the higher profile components (4025) to fail first. I agree with Werner it
is the encapsulant but hopefully it can be made to work but everything needs to
optimized solder, cte, modulus, shrinage and Tg.
dale
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