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March 2011

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Mon, 28 Mar 2011 13:14:40 -0400
Content-Type:
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 Hi Dale,
There are a number of ways.
(1) 'Stake' the components [most effective];
(2) Glue the components to the covercoat underneath the component [somewhat less 
effective];
(3) Reduce soldering pad size to less than component outline to eliminate 
fillets and 'swim' the component up [least effective]
Werner.

 

 


 

 

-----Original Message-----
From: Dale Hart <[log in to unmask]>
To: [log in to unmask]
Sent: Mon, Mar 28, 2011 8:36 am
Subject: [TN]


Technet Folks

 

 I'm not a process engineer, sooo how would one go about increasing the solder 

joint height (G dimension) under a component.  The company's components 

generally have a height of 10 -20 um.  The screen thickness is 6 mils.  The 

solder is 62Sn 36Pb 2Ag not sure about the flux, particle size, storage time 

between printing, pick and place, and convection reflow, if that is important.  

The chip resistors are about 2012, caps 3225, with SOP16 (copper lead frames).

Didn't actually measure the pad size but visually they appear properly sized for 



the various components.  The pick n place machine is an older type that uses a 

spring loaded head and they program each component height into the machine.

 

Dale Hart

Universal Technology Corporation



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