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| Date: | Mon, 28 Mar 2011 05:36:07 -0700 |
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Technet Folks
I'm not a process engineer, sooo how would one go about increasing the solder
joint height (G dimension) under a component. The company's components
generally have a height of 10 -20 um. The screen thickness is 6 mils. The
solder is 62Sn 36Pb 2Ag not sure about the flux, particle size, storage time
between printing, pick and place, and convection reflow, if that is important.
The chip resistors are about 2012, caps 3225, with SOP16 (copper lead frames).
Didn't actually measure the pad size but visually they appear properly sized for
the various components. The pick n place machine is an older type that uses a
spring loaded head and they program each component height into the machine.
Dale Hart
Universal Technology Corporation
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