The hmp lead exemption is still listed in the proposed recast version of RoHS 
which is just waiting on translation difficulties to become law. Specifically it 
now states:

7.  - Lead in high melting temperature type solders (i.e. lead-based alloys 
containing 85 % by weight or more lead),

   – lead in solders for servers, storage and storage array systems, network 
infrastructure equipment for switching, signalling, transmission as well as 
network management for telecommunications, 
   – lead in electronic ceramic parts (e.g. piezoelectronic devices). 

Note that all exemptions would be subject to review within 5 years, or 7 years 
if the product has only just come into scope from the new version of RoHS 
(see Article 5 of the new vesion)

Hope that helps a bit!

Nigel

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