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March 2011

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Subject:
From:
Paul Reid <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Reid <[log in to unmask]>
Date:
Thu, 17 Mar 2011 09:06:27 -0400
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text/plain
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text/plain (37 lines)
Hi U.

There are two printed circuit board level failures that are prone to
give intermittent opens after assembly. Certain types of buried and
microvia failures are noted for acting like on and off switches. Both
can go open by flexing or heating the assembly. Lead free assembly tends
to exacerbate these failure modes.



Sincerely, 
Paul Reid 

Program Coordinator 
PWB Interconnect Solutions Inc. 
235 Stafford Rd., West, Unit 103 
Nepean, Ontario 
Canada, K2H 9C1 
613 596 4244 ext. 229 
Skype paul_reid_pwb 
[log in to unmask] <mailto:[log in to unmask]> 

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