Thanks Dave et al for the input.

Additionally I have found that European Space Agency has an ECSS standard document that actually addresses CGAs (ECSS$B!>(BQ$B!>(BST$B!>(B70$B!>(B38C) somewhat with respect to workmanship. 

The website is 

http://esmat.esa.int/Specifications/specifications.html

I could not easily find the equivalent from NASA but then it might just be harder to find.

I looked for references to CGAs in J-STD-001, including DS but to no avail.

Considering that others on Technet are using CGAs, are we behind in getting this incorporated into our IPC documentation?

I also noticed that there are FOUR types considered by NASA:  PBGA, CBGA, PCGA, CCGA which only makes this more complicated.

Phil

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Friday, March 11, 2011 5:58 AM
To: [log in to unmask]
Subject: Re: [TN] CCGAs vs BGAs

Hi Phil -  you have gotten several responses on your question but here is 
a different perspective. Can CGAs be successfully used on pwas? 
Absolutely. Is using CGAs a simple assembly task? Nope, far from it. My 
opinion of a CGA is that it is a BGA component with potential coplanarity 
issues. One of the reasons for using the CGA package, in comparison to a 
CBGA,  is that increasing the solder joint height results in improved 
solder joint integrity (look at Werner's solder joint reliability 
equations and how height influences the final results). The problem is 
that if the columns get bent you have manufacturing issues which end up 
impacting long term reliability. IBM has published several papers at the 
SMTAI conferences which show that thermal cycle solder joint reliability 
is degraded when the columns are bent. We have conducted similar thermal 
cycle investigations with the same outcome. There is a fairly large number 
of product designs that successfully use CGAs but I don't know if you 
would classify the CGA package style as a "preferred" style. I like BGA 
packages due to their ease of assembly and a CGA package style just adds 
complexity that I think is avoidable. Good Luck on the design.

Dave Hillman
Rockwell Collins
[log in to unmask]



Phil Bavaro <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
03/10/2011 12:23 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
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Subject
[TN] CCGAs vs BGAs






Are there a lot of Technet folks using Ceramic Column Grid Arrays?

 

Somehow I have managed to dodge that bullet until now.  In the telecom
arena, my impression was it was better to keep my designs limited to
BGAs but I suspect that things might have changed now that I am dealing
with hi-rel designs.

 

Any advice is appreciated.

 

Phil







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