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March 2011

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Subject:
From:
vladimir Igoshev <[log in to unmask]>
Reply To:
Date:
Fri, 11 Mar 2011 01:43:17 +0000
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Well, that was what I saw. 
After looking at the link Steve sent, I think it might have been misunderstanding (mainly from my site), as I was referring to C4 and not columns like in the Steve's link.
Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

-----Original Message-----
From: Werner Engelmaier <[log in to unmask]>
Date: Thu, 10 Mar 2011 20:30:28 
To: <[log in to unmask]>; <[log in to unmask]>
Subject: Re: [TN] CCGAs vs BGAs


 That does not explain anything.
Werner

 


 

 

-----Original Message-----
From: vladimir Igoshev <[log in to unmask]>
To: Werner Engelmaier <[log in to unmask]>; [log in to unmask]
Sent: Thu, Mar 10, 2011 5:36 pm
Subject: Re: [TN] CCGAs vs BGAs


   Werner,

If you take a look at C4s of large (around 1") ASICs in  section you'll see the corner "balls" tilted towards each other. 
Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

From:  Werner Engelmaier <[log in to unmask]>
Date: Thu, 10 Mar 2011 17:31:49 -0500
To: <[log in to unmask]>; <[log in to unmask]>
Subject: Re: [TN] CCGAs vs BGAs


 Please explain that.
Werner

 


 

 

-----Original Message-----
From: vladimir Igoshev <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; Werner Engelmaier <[log in to unmask]>
Sent: Thu, Mar 10, 2011 4:10 pm
Subject: Re: [TN] CCGAs vs BGAs


And in large packages they can be "bent" (at room temperature"  by design to 





accommodate for CTE difference at higher temperatures.





Vladimir











SENTEC Testing Laboratory Inc.





11 Canadian Road, Unit 7.





Scarborough, ON M1R 5G1





Tel: (416) 899-1882





Fax: (905) 882-8812





www.sentec.ca











-----Original Message-----





From: Werner Engelmaier <[log in to unmask]>





Sender: TechNet <[log in to unmask]>





Date:         Thu, 10 Mar 2011 15:27:54 





To: <[log in to unmask]>





Reply-To: TechNet E-Mail Forum <[log in to unmask]>,





        Werner Engelmaier <[log in to unmask]>





Subject: Re: [TN] CCGAs vs BGAs











 Hi Ioan,





What they told you, "if the columns are bent more than 10 degrees, they end up 





with plastic deformations, which affects long term reliability" is a Red 





Herring. YES, you get plastic deformation, and YES, you have problems if you do 





not straighten the columns out prior to placement, BUT NO, you do NOT affect 





long-term-reliability.  It is ONE cycle of many to come.





Werner











 

















 











 











-----Original Message-----





From: Ioan Tempea <[log in to unmask]>





To: [log in to unmask]





Sent: Thu, Mar 10, 2011 3:12 pm





Subject: Re: [TN] CCGAs vs BGAs

















Phil,























I have only assembled them once, in a previous life, and I can tell you one 











thing: you have to make sure all the assembly chain (starting with Incoming and 











ending with Packing) be advised about what these components are.























I have learned this when getting a call from the Stores telling me those new 











components had a problem, the pins being too soft. Besides the fact they were 











coming from the customer and they had been removed from the original trays only 











to be shipped in a square box, it turned out (after calling Intel) that if the 











columns are bent more than 10 degrees, they end up with plastic deformations, 











which affects long term reliability. So we had to scrap a few parts costing $900 

















each...























They solder well, if solder volume is per manufacturer's specification, but the 











placement machine vision systems will have a problem with the white ceramic 











body. If you can, specify dark body.























Good luck,























Ioan Tempea, ing.











Ingénieur Principal de Fabrication / Senior Manufacturing Engineer











T | 450.967.7100 ext.244











E | [log in to unmask] 











W | www.digico.cc























N'imprimer que si nécessaire - Print only if you must























-----Original Message-----











From: Phil Bavaro <[log in to unmask]>











To: [log in to unmask]











Sent: Thu, Mar 10, 2011 1:23 pm











Subject: [TN] CCGAs vs BGAs



































Are there a lot of Technet folks using Ceramic Column Grid Arrays?















































 















































Somehow I have managed to dodge that bullet until now.  In the telecom























arena, my impression was it was better to keep my designs limited to























BGAs but I suspect that things might have changed now that I am dealing























with hi-rel designs.















































 















































Any advice is appreciated.















































 















































Phil







































































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