Many companies strip off the solder balls on certain BGA components and have columns attached. They experience greatly increased reliability test results with Pb90 columns over Sn63 balls, due to the fact that the Pb90 column has better elasticity than the Sn63 cheese loaf and is better able to withstand a large delta CTE between the component interposer and the PWB. I know of at least 7 companies in the Upper Midwest who do this. One of my client companies does this using laser as part of their re-balling or original ball attachment services and there is no heating of the component body when using laser. You need to check, but I believe Pb90 columns required as part of the component body are exempt from RoHS. Can anyone verify that?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Bavaro
Sent: Thursday, March 10, 2011 12:24 PM
To: [log in to unmask]
Subject: [TN] CCGAs vs BGAs

Are there a lot of Technet folks using Ceramic Column Grid Arrays?

 

Somehow I have managed to dodge that bullet until now.  In the telecom
arena, my impression was it was better to keep my designs limited to
BGAs but I suspect that things might have changed now that I am dealing
with hi-rel designs.

 

Any advice is appreciated.

 

Phil


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