Hi Joey,

For IPC-6012 -

1) 3.5.3.2 is conductor thickness and is applied global to the board surface.

2) 3.5.4.2.2 states for round surface mount pads the global statement in 3.5.3.2 does not apply to the pristine area of the pad.

I view 3.5.4.2.2 as an exception to 3.5.3.2.

Randy
 
Randy Reed, CQE
Reliability Lab
Viasystems Group Inc.
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-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Jose A Rios
Sent: Thursday, March 10, 2011 9:41 AM
To: [log in to unmask]
Subject: [IPC-600-6012] bga workmanship criteria for 6015 designs

Wondering how some of you would evaluate workmanship of round surface 
mount lands (BGA's, non-wirebond) for designs calling out fabrication and 
inspection per IPC 6015 only , and the User does not know what AABUS 
means....
The closest thing I come to is IPC 6015 paragraph 3.5.3.2, however it's 
not written in a 'round' context and the boundaries of the edge vs 
internal area are not explicitely stated. 
Do I then go to 6012, 3.5.4.2.2 ??? 

Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896

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