Well, for starters, the dip paste used to stack the packages is more
prone to solder balling. This is because it has a lower metal content
and smaller solder particle than screen-printable pastes. Also, it's
fairly easy to drown the part in flux. You need to take care to apply
liquid flux only to the surface of the balls.
I should add that Bob Willis is doing a webinar on PoP during Virtual
PCB next week.
http://circuitsassembly.com/cms/news/10851-pop-signal-integrity-webinars
-highlight-virtual-pcb
Best,
Mike
Mike Buetow
Circuits Assembly
w/m 617-327-4702
>>> VIRTUAL PCB, the industry's only online tech conference and
exhibition, March 8-9, www.virtual-pcb.com <<<
Follow me on Twitter: twitter.com/mikebuetow
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Christopher Young
Sent: Wednesday, March 02, 2011 9:33 AM
To: [log in to unmask]
Subject: [TN] POP THE QUESTION??
Can anyone out there give me the pitfalls of POP placement Technology
(Package on package) within manufacturing.
Also names of CEM's within the UK capable of successfully placing down
such devices.
Regards
Chris
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