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March 2011

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Tue, 29 Mar 2011 05:35:11 -0700
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TechNet E-Mail Forum <[log in to unmask]>, Dale Hart <[log in to unmask]>
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Dale Hart <[log in to unmask]>
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The component sizes are 2012 or 1310 chip components.  Actually I expected some 
of the higher profile components (4025) to fail first.  I agree with Werner it 
is the encapsulant but hopefully it can be made to work but everything needs to 
optimized solder, cte, modulus, shrinage and Tg. 
 
dale

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