Joey, OK. I thought the 6015 was a mistype.
Randy
Randy Reed, CQE
Reliability Lab
Viasystems Group Inc.
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-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Jose A Rios
Sent: Friday, March 11, 2011 10:25 AM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] bga workmanship criteria for 6015 designs
randy, the 3.5.3.2 i refer to is 6015, not 6012.
Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896
"Reed, Randy" <[log in to unmask]>
Sent by: IPC-600-6012 <[log in to unmask]>
03/11/2011 01:19 PM
Please respond to
"(Combined Forum of D-33a and 7-31a Subcommittees)" <[log in to unmask]>
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Subject
Re: [IPC-600-6012] bga workmanship criteria for 6015 designs
Hi Joey,
For IPC-6012 -
1) 3.5.3.2 is conductor thickness and is applied global to the board
surface.
2) 3.5.4.2.2 states for round surface mount pads the global statement in
3.5.3.2 does not apply to the pristine area of the pad.
I view 3.5.4.2.2 as an exception to 3.5.3.2.
Randy
Randy Reed, CQE
Reliability Lab
Viasystems Group Inc.
[log in to unmask]
503.992.4421-direct l 503.545.0150-cell
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Jose A Rios
Sent: Thursday, March 10, 2011 9:41 AM
To: [log in to unmask]
Subject: [IPC-600-6012] bga workmanship criteria for 6015 designs
Wondering how some of you would evaluate workmanship of round surface
mount lands (BGA's, non-wirebond) for designs calling out fabrication and
inspection per IPC 6015 only , and the User does not know what AABUS
means....
The closest thing I come to is IPC 6015 paragraph 3.5.3.2, however it's
not written in a 'round' context and the boundaries of the edge vs
internal area are not explicitely stated.
Do I then go to 6012, 3.5.4.2.2 ???
Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896
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