Tan,
That sounds like Beamworks. http://beamworks.com
Best,
Mike
Mike Buetow
Circuits Assembly
w/m 617-327-4702
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tan Geok Ang
Sent: Thursday, February 10, 2011 8:15 AM
To: [log in to unmask]
Subject: Re: [TN] Vapour phase soldering?
Thank for the information. I remembered that once I visited a
tech/equipment show case, there was a machine which use laser/IR to
solder BGA component onto a PCB and also able to remove/desolder the BGA
from the PCB but was not able to find the source though will like to try
it out. Once again, thank you.
________________________________
From: TechNet on behalf of Stadem, Richard D.
Sent: Thu 2/10/2011 6:44 AM
To: [log in to unmask]
Subject: Re: [TN] Vapour phase soldering?
It is a custom built laser solder system developed and built at Analog
Technologies Corp. in Burnsville. We designed it and had an outside
integrator build it for us. We wanted something that could do everything
we needed, and none of the laser soldering machines on the market were
capable nor are they yet. It uses a 60W laser, but has a total of four
slots for different energy sources such as UV, another 150W laser for
welding and cutting, and an IR source. All four slots are routed to the
head, which can rotate and direct any of the energies at almost any
angle above the work plane. It has a precision repeatability of 2
microns, and the source energy can be automatically programmed for both
dwell time and power level, as well as the speed of the head, and the
speed of rotation of the head. So for example, I can program it to lase
in a figure "S" starting at the top at one speed and accelerating (or
decelerating) down the "S" curve at different speeds while at the same
time increasing or decreasing the laser power and angle of contact, and
I can also vary the focal spot in size as I go. This allows me to focus
lots of energy into a very small area, or less energy over a larger
focal spot, or vice versa.
Analog uses the machine for a large variety of applications, including
BGA, CSP, and flipchip ball attachment or reballing. They also use it to
solder components, especially LEDs, that cannot withstand the heat of
convection reflow. Other uses are ablation, microwelding, precision uv
cure, precision IR cure of epoxies, laser marking of PWBs and metals,
etc. It has a vision system mounted on the head as well so that we can
safely watch the parts being soldered or whatever inside the work
chamber. We can program it for an automatic inspection process using the
camera system. So for example, we can first lase, then cure, then mark,
then cut, etc, and not necessarily in any order, and then go back and
inspect all of the work done afterwards.
We developed a reballing process that does not use nitrogen although the
work chamber is plumbed and is sealed so it can be purged with nitrogen
if so desired. However, we developed a chemical bath that evacuates all
oxygen (100% of O2 is removed) during the laser soldering process so
nitrogen is not required. The BGA or component body is never heated, all
of the laser energy is directed to the ball. The result is perfectly
pristine solder spheres (or columns) perfectly wetted to the BGA pads.
Read about it here:
http://www.analog-tech.com/Solder%20Ball%20Attachment%20Using%20Laser%20
Soldering.pdf
From: Tan Geok Ang [mailto:[log in to unmask]]
Sent: Wednesday, February 09, 2011 2:43 PM
To: TechNet E-Mail Forum; Stadem, Richard D.; [log in to unmask]
Subject: RE: [TN] Vapour phase soldering?
Just wonder what brand/model of the laser system are you using to laser
solder CCA?
________________________________
From: TechNet on behalf of Stadem, Richard D.
Sent: Wed 2/9/2011 10:36 PM
To: [log in to unmask]
Subject: Re: [TN] Vapour phase soldering?
It is not an issue. While initially some parts may take slightly longer,
the heating of the entire CCA during vapor phase soldering is very
uniform, especially for high-mass CCAs. It is the best mass reflow
method available, followed by convection oven, and lastly infrared in
terms of temperature control (minimization of thermal gradients). There
are other reflow methods that are more precise, such as laser soldering
which I do a lot of, but that is not considered to be mass reflow.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW
Sent: Wednesday, February 09, 2011 6:54 AM
To: [log in to unmask]
Subject: Re: [TN] Vapour phase soldering?
I haven't used vapor phase, but it would seem that while the temperature
of the vapor bath is extremely controlled, the rate of heating can be an
issue, not only for hitting a defined profile, but because the rate of
heat absorption is mostly a function of surface area. So if you have a
small but thermally massive device next to a large but low mass device,
then you will have quite a bit of delta T during the cycle.
But I haven't seen mention of the above principle during this thread.
Is it because it's not really an issue?
Wayne Thayer
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Naisbitt
Sent: Wednesday, February 09, 2011 6:30 AM
To: [log in to unmask]
Subject: Re: [TN] Vapour phase soldering?
Techies
I know that there are solvents with very specific boiling points from
185C to >280C at 5C or 10C increments.
When I was involved in this technology, we used a 220C BP solvent that
worked superbly with SAC305 and similar lead-free alloys that gave us a
1C DeltaT.
I would avoid high BP solvents unless your alloy really demands it. Of
course part of the problem with most systems is maintaining and
controlling the T profile. We did it in our equipment using a sealed
chamber. That patented technology is, I believe, now exclusively
available out of REHM - with whom I have no association, in case anyone
was wondering!
Hope this helps
Graham N
Gen3 Systems, UK
www.gen3systems.com
On 8 Feb 2011, at 20:43, Paul Edwards wrote:
> Have used Alpha WS-809 at 240C if the profile is relatively peaky...
>
> Paul
>
> Paul Edwards
> Process/Quality Engineering
> Surface Art Engineering
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Julie Silk
> Sent: Tuesday, February 08, 2011 12:37 PM
> To: [log in to unmask]
> Subject: Re: [TN] Vapour phase soldering?
>
> For the first, we use VPR at a couple of suppliers, Jabil and Venture,
but they
> don't have the capability at all sites.
>
> For the second, the concern is that the standard flux used in tin-lead
paste
> typically will not survive 240C. It will burn out and you won't get
good joints.
> You can use tin-lead with higher temperature flux.
>
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