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February 2011

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Wed, 9 Feb 2011 13:36:03 -0500
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text/plain (358 lines)
 Hi,
It is not really an issue, particularly with the modern controlled machines sold nowadays.
Werner

 


 

 

-----Original Message-----
From: Thayer, Wayne - IIW <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Feb 9, 2011 7:53 am
Subject: Re: [TN] Vapour phase soldering?


I haven't used vapor phase, but it would seem that while the temperature of the 

vapor bath is extremely controlled, the rate of heating can be an issue, not 

only for hitting a defined profile, but because the rate of heat absorption is 

mostly a function of surface area.  So if you have a small but thermally massive 

device next to a large but low mass device, then you will have quite a bit of 

delta T during the cycle.



But I haven't seen mention of the above principle during this thread.  Is it 

because it's not really an issue?



Wayne Thayer



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Naisbitt

Sent: Wednesday, February 09, 2011 6:30 AM

To: [log in to unmask]

Subject: Re: [TN] Vapour phase soldering?



Techies



I know that there are solvents with very specific boiling points from 185C to 

>280C at 5C or 10C increments.



When I was involved in this technology, we used a 220C BP solvent that worked 

superbly with SAC305 and similar lead-free alloys that gave us a 1C DeltaT.



I would avoid high BP solvents unless your alloy really demands it. Of course 

part of the problem with most systems is maintaining and controlling the T 

profile. We did it in our equipment using a sealed chamber. That patented 

technology is, I believe, now exclusively available out of REHM - with whom I 

have no association, in case anyone was wondering!



Hope this helps



Graham N



Gen3 Systems, UK

www.gen3systems.com



On 8 Feb 2011, at 20:43, Paul Edwards wrote:



> Have used Alpha WS-809 at 240C if the profile is relatively peaky...

>

> Paul

>

> Paul Edwards

> Process/Quality Engineering

> Surface Art Engineering

>

>

> -----Original Message-----

> From: TechNet [mailto:[log in to unmask]] On Behalf Of Julie Silk

> Sent: Tuesday, February 08, 2011 12:37 PM

> To: [log in to unmask]

> Subject: Re: [TN] Vapour phase soldering?

>

> For the first, we use VPR at a couple of suppliers, Jabil and Venture, but 

they

> don't have the capability at all sites.

>

> For the second, the concern is that the standard flux used in tin-lead paste

> typically will not survive 240C.  It will burn out and you won't get good 

joints.

> You can use tin-lead with higher temperature flux.

>

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