Graham,
Thanks for that, and all other responses. I'm just sat back pondering
the feedback. I have a little background with 1st generation systems &
yes I am aware the technology has advanced an awful lot however, as
always it's very educating listening to fellow colleagues
experiences/perceptions. The beauty of these forums is the ability to
get a balanced appraisal.
Regards,
Iain.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Naisbitt
Sent: 09 February 2011 14:59
To: [log in to unmask]
Subject: Re: [TN] Vapour phase soldering?
*** WARNING ***
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The rate can be a challenge, but some can deal with this far better than
others.
As an example, if the solvent is injected onto a heated plate, then the
rate of physical rise of the developing vapour permits an accurate
profile to be obtained.
As regards DetaT, I have seen assemblies with more than 28 BGA's of all
sizes, soldered with absolute uniformity. Of course the physics are such
that the vapour will penetrate all the way under every nook and cranny
with minimal thermal difference between the outer and inner areas - we
achieved 1 Degree C! That is a huge advantage over every other soldering
method. The downside is the cost of the solvent - typically more than
$100 per quart (roughly 2 pounds weight) and the potential solvent
losses in process. The solvent also has a huge GWP, as Brian Ellis will
doubtless testify.
Nevertheless, I think there is a huge benefit for VP soldering if its
done correctly, most especially with lead-free alloys.
Graham N
Gen3 Systems
www.gen3systems.com
On 9 Feb 2011, at 12:53, Thayer, Wayne - IIW wrote:
> I haven't used vapor phase, but it would seem that while the
temperature of the vapor bath is extremely controlled, the rate of
heating can be an issue, not only for hitting a defined profile, but
because the rate of heat absorption is mostly a function of surface
area. So if you have a small but thermally massive device next to a
large but low mass device, then you will have quite a bit of delta T
during the cycle.
>
> But I haven't seen mention of the above principle during this thread.
Is it because it's not really an issue?
>
> Wayne Thayer
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Naisbitt
> Sent: Wednesday, February 09, 2011 6:30 AM
> To: [log in to unmask]
> Subject: Re: [TN] Vapour phase soldering?
>
> Techies
>
> I know that there are solvents with very specific boiling points from
185C to >280C at 5C or 10C increments.
>
> When I was involved in this technology, we used a 220C BP solvent that
worked superbly with SAC305 and similar lead-free alloys that gave us a
1C DeltaT.
>
> I would avoid high BP solvents unless your alloy really demands it. Of
course part of the problem with most systems is maintaining and
controlling the T profile. We did it in our equipment using a sealed
chamber. That patented technology is, I believe, now exclusively
available out of REHM - with whom I have no association, in case anyone
was wondering!
>
> Hope this helps
>
> Graham N
>
> Gen3 Systems, UK
> www.gen3systems.com
>
> On 8 Feb 2011, at 20:43, Paul Edwards wrote:
>
>> Have used Alpha WS-809 at 240C if the profile is relatively peaky...
>>
>> Paul
>>
>> Paul Edwards
>> Process/Quality Engineering
>> Surface Art Engineering
>>
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Julie Silk
>> Sent: Tuesday, February 08, 2011 12:37 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] Vapour phase soldering?
>>
>> For the first, we use VPR at a couple of suppliers, Jabil and
>> Venture, but they don't have the capability at all sites.
>>
>> For the second, the concern is that the standard flux used in
>> tin-lead paste typically will not survive 240C. It will burn out and
you won't get good joints.
>> You can use tin-lead with higher temperature flux.
>>
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