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February 2011

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Subject:
From:
Reuven Rokah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Reuven Rokah <[log in to unmask]>
Date:
Mon, 7 Feb 2011 21:48:40 +0200
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It's depend if the component is BGA or non BGA, if the components are
designed to pass through lead free reflow profile, if the system should be
RoHS comply or not, etc.

Reuven  ROKAH

On Mon, Feb 7, 2011 at 4:33 PM, Stadem, Richard D. <[log in to unmask]>wrote:

> We answered that question last week. Look it up in the history archives.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Christopher Young
> Sent: Friday, February 04, 2011 7:10 AM
> To: [log in to unmask]
> Subject: [TN] Lead Free
>
> Hi, anyone know what the policy is regarding  the use and protection
> from failure of mixed lead and non lead components and soldering
> process. Does anyone  have a company philosophy or policy as I believe
> this is a requirement for Fire and Avionics environment.
>
>
>
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