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February 2011

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Fri, 4 Feb 2011 07:29:59 -0500
Content-Type:
text/plain
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text/plain (83 lines)
Hi,
No concern.
Werner

-----Original Message-----
From: Braddock, Iain (UK) <[log in to unmask]>
To: [log in to unmask]
Sent: Fri, Feb 4, 2011 7:24 am
Subject: [TN] Vapour phase soldering?

Thanks for the feedback on VP supplier's.

Next couple of questions::

1)    Are there many high rel. OEMs / CEMs out there using this
technology?

2)    This one for the reliability guru's; do you believe there are any
concerns regarding reflowing SnPb63/37 assemblies at a VP temperature of
240C, obviously assuming the components are deemed suitable; I'm
thinking impact on intermetallic layer & reliability?

CIA,
    Iain.

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