TECHNET Archives

February 2011

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Solderability of Matte Sn Finish Package
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Mon, 28 Feb 2011 07:59:50 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (64 lines) 
Jonathan,

Do XRF measurements of the Sn plating thickness on the two packages.

Regards,
George
George M. Wenger
Senior Principal Reliability / FMA Engineer
Andrew Corporation - Wireless Network Solutions
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 Office (732) 309-8964 Mobile
E-mail: [log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of jonathan noquil
Sent: Monday, February 28, 2011 8:45 AM
To: [log in to unmask]
Subject: [TN] Solderability of Matte Sn Finish Package

Hi All

I noticed that there are differences in the solderability of two packages
mounted on the same board side by side with each other
using the same reflow profile and paste.

The first package has almost less than 5 % voids of the total area and the
other package has almost 90 % voiding.

Would there be an effect of the Sn plating quality to the solderability of
these packages? What are the factors affecting Sn plating quality?

Thanks


______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/ContentPage.aspx?Pageid=E-mail-Forums for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/ContentPage.aspx?Pageid=E-mail-Forums for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2