Hi All

I noticed that there are differences in the solderability of two packages
mounted on the same board side by side with each other
using the same reflow profile and paste.

The first package has almost less than 5 % voids of the total area and the
other package has almost 90 % voiding.

Would there be an effect of the Sn plating quality to the solderability of
these packages? What are the factors affecting Sn plating quality?

Thanks


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