The ceramic cap termination is touching one of the solder joint ball
(reducing it's volume) and very close to the adjacent via hole (may cause
short).

I think it should be repaired.

Reuven

On Fri, Feb 11, 2011 at 7:37 PM, Genny Gibbard <[log in to unmask]>wrote:

> Please see the link below.
> Cap under BGA.
> Inquiring minds question: If the board tested out OK, would you ever
> consider just leaving this here? The part is a ceramic cap.
>
>
> ________________________________
>
> From: Steve Gregory [mailto:[log in to unmask]]
> Sent: February 11, 2011 10:37 AM
> To: Genny
>  Subject: RE: What would you do?
>
>
>
> Hi Genny,
>
>
>
> I have your picture posted:
>
>
>
> http://stevezeva.homestead.com/part_under_BGA.jpg
>
>
>
> It depends. First thing I would want to know, what is this? Is it metal?
> If it is, it would be a violation of electrical spacing and I wouldn't
> leave it there.
>
>
>
> Does the ball have any function? Some balls have no function.
>
> What is this board for? A critical application? If it is then no.
>
> How scarce is the BGA?
>
>
>
> There's a lot of "it depends" that would have to be answered before I
> would consider it.
>
>
>
> My first reaction is that I wouldn't leave it there. But there may be
> some circumstances that I might consider it.
>
>
>
> Steve
>
>
>
> From: Genny
>
>  Sent: Friday, February 11, 2011 10:32 AM
> To: Steve Gregory
> Subject: What would you do?
>
>
>
> <<part under BGA.jpg>>
>
> Genny
>
>
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