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| Date: | Fri, 11 Feb 2011 16:54:09 +0000 |
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To Jack
If you read you could solder to oxidized boards, the rest of the story may have referenced a certain OA flux or OA solder paste.
The success rate of soldering to oxidized boards drops substantially when you switch to the less active No-Cleans.
Then there is the reliability issue where it appears that the solder joint formed OK but if the board was tested in a HALT test system for stress/vibration you'd see the joint fracture way before 1000 cycles was reached.
John Goulet
MFG/Process Engineer
----- Original Message -----
From: "Jack Olson" <[log in to unmask]>
To: [log in to unmask]
Sent: Wednesday, February 9, 2011 9:10:43 AM
Subject: Re: [TN] IPC-4553
Good question.... and when looking at an actual board, how is one to determine
visually if we are looking at "staining" or "oxidation/corrosion"? Inquiring minds
want to know.
(many would say that even oxidized boards are solderable and acceptable.
right? I think I just read that somewhere...)
Jack
.
On Tue, 8 Feb 2011 09:20:44 -0500, Glidden, Kevin
<[log in to unmask]> wrote:
>Morning everyone,
>I have a question on IPC-4553, specifically, section 3.1 "Visual", and
specifically regarding staining of immersion silver. The text states "The
coverage shall be complete and the finish shall be uniform on the surface to be
plated (see Figures 3-1 through 3-5 for properties visually identified with IAg
plated surfaces)" Figure 3-1 shows 'Example of Uniform Plating", with no
staining. Figures 3-2 through 3-5 show staining. Is this to imply (without text
to support) that any staining of immersion silver is determined to be non-
uniform and therefore a defect?
>Thanks.
>
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