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Date: | Thu, 17 Feb 2011 14:04:21 -0600 |
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HP / Agilent figured out 3 decades ago that the use of IPA and a brush or
swab to remove RMA flux residues caused more harm than good. The active
components of the flux spread all over the board, reducing insulation
resistance that was especially harmful for high frequency circuits. No matter
what solvent you use, the manual nature of this cleaning process lowers your
likelihood of a thorough cleaning job and increases your likelihood of leaving
behind active or conductive material. That was back in the TH days and now
with SMT parts and low or no clearance parts, it's even more important to not
spread activators into places where you can't get them out. Field repair
techs have no access to elaborate wash processes, and water-sensitive parts
prevent these processes, too. Our specs call for not cleaning rework or hand-
solder RMA flux residues as long as they are hard, not tacky and have not
been disturbed. This works for the environments where Agilent equipment. is
used
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