Sender: |
|
X-To: |
|
Date: |
Fri, 4 Feb 2011 07:29:59 -0500 |
Reply-To: |
|
Subject: |
|
From: |
|
Content-Type: |
text/plain; charset="us-ascii"; format=flowed |
In-Reply-To: |
|
MIME-Version: |
1.0 |
Content-Transfer-Encoding: |
quoted-printable |
Parts/Attachments: |
|
|
Hi,
No concern.
Werner
-----Original Message-----
From: Braddock, Iain (UK) <[log in to unmask]>
To: [log in to unmask]
Sent: Fri, Feb 4, 2011 7:24 am
Subject: [TN] Vapour phase soldering?
Thanks for the feedback on VP supplier's.
Next couple of questions::
1) Are there many high rel. OEMs / CEMs out there using this
technology?
2) This one for the reliability guru's; do you believe there are any
concerns regarding reflowing SnPb63/37 assemblies at a VP temperature of
240C, obviously assuming the components are deemed suitable; I'm
thinking impact on intermetallic layer & reliability?
CIA,
Iain.
********************************************************************
This email and any attachments are confidential to the intended
recipient and may also be privileged. If you are not the intended
recipient please delete it from your system and notify the sender. You
should not copy it or use it for any purpose nor disclose or distribute
its contents to any other person.
MBDA UK Limited, a company registered in England and Wales,
registration number 3144919 whose registered office is at Six Hills
Way, Stevenage, Hertfordshire, SG1 2DA, England.
********************************************************************
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please visit http://www.messagelabs.com/email
______________________________________________________________________
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or
[log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/ContentPage.aspx?Pageid=E-mail-Forums for additional
information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/ContentPage.aspx?Pageid=E-mail-Forums for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|