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January 2011

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Subject:
From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Wed, 12 Jan 2011 10:54:53 -0500
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No do Carl,

IR or convection do not bring everything at temperature at the same time. Don't know about vapour phase though.

Imbalance is an important cause for tombstoning.

Regards,

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] 
W | www.digico.cc

N'imprimer que si nécessaire - Print only if you must


-----Message d'origine-----
De : Carl VanWormer [mailto:[log in to unmask]] 
Envoyé : January-12-11 10:50 AM
À : [log in to unmask]
Objet : Re: [TN] Trace Widths Entering SMT

Novice question . . .
I was told that the heating imbalance "goes away" in the IR reflow
process, since "the whole thing" has been brought up to temperature at
"the same time".  

Question:  can we "mostly ignore" potential thermal imbalances caused by
asymmetrical traces shape/width for IR reflow process boards?  (or have
I been lied to, again . . .)

Thanks,
Carl

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