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Hi Dave, it's been a while...
1) One of my concerns IS gold embrittlement. It seems that the overa=
ll thick-film gold thickness will be about 25-30 microns.
2) I don't totally understand the construction. I think it will be ju=
st thick-film gold pad applied over a gold via coming out of the bottom of =
the package. Something like 8-10 microns of gold glass (?) with 15-20 micr=
ons of thick-film gold over that.
As I said before, I have minimal experience with the thick-film process... =
not like plain old plating.
Jim Marsico
ITT Corporation
1500 New Horizons Blvd.
North Amityville, NY 11701
631-630-5079
[log in to unmask]<mailto:[log in to unmask]>
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, January 06, 2011 10:24 AM
To: TechNet E-Mail Forum; Marsico, James - ES
Cc: [log in to unmask]
Subject: Re: [TN] Solder Ball Attachment to Thick Film Gold
Hi Jim - welcome back! A couple of things you should be concern about: (1) =
gold embrittlement - you need to make sure that the gold content of the fin=
al solder joint is less than 3 weight % or you will form a gold/tin interme=
tallic phase which degrades the solder joint integrity; (2) dissolution of =
the thick film gold plating - you need to make sure that the soldering proc=
ess doesn't completely leach/diffuse the thick film gold plating from the p=
ackage substrate. This may not be an issue depending on what type of platin=
g is between the gold and the package substrate (i.e. do you have a nickel =
subplating layer).
Dave Hillman
Rockwell Collins
[log in to unmask]
"Marsico, James - ES" <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
01/06/2011 08:52 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"Marsico, James - ES" <[log in to unmask]>
To
[log in to unmask]
cc
Subject
[TN] Solder Ball Attachment to Thick Film Gold
Good Day Technet:
I've been a way from Technet for a number of years, but now I'm glad to be =
back.
Not being all that familiar with the thick-film process, maybe someone can =
help. We are in the process of designing a BGA multichip module where we'r=
e working with a supplier who will supply the empty package. The supplier =
wants to use thick-film gold for the external I/O pads, where we will be at=
taching solder balls after the component is assembled. I have no experienc=
e soldering tin-lead solder balls to thick-film gold and was wondering if t=
his is a standard practice or if we're breaking new ground. Although this=
is a developmental program, this assembly will eventually be flight-worthy=
for a military avionics project.
Thanks in advance for your help,
Jim Marsico
ITT Corporation
1500 New Horizons Blvd.
North Amityville, NY 11701
631-630-5079
[log in to unmask]<mailto:[log in to unmask]>
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</o:shapelayout></xml><![endif]--></head><body lang=3DEN-US link=3Dblue vli=
nk=3Dpurple><div class=3DWordSection1><p class=3DMsoNormal><span style=3D'f=
ont-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'>Hi Dave, =
it’s been a while…<o:p></o:p></span></p><p class=3DMsoListParag=
raph style=3D'text-indent:-.25in;mso-list:l0 level1 lfo2'><![if !supportLis=
ts]><span style=3D'font-size:11.0pt;font-family:"Calibri","sans-serif";colo=
r:#1F497D'><span style=3D'mso-list:Ignore'>1)<span style=3D'font:7.0pt "Tim=
es New Roman"'> </span></span></span><![endif=
]><span style=3D'font-size:11.0pt;font-family:"Calibri","sans-serif";color:=
#1F497D'> One of my concerns <b>IS</b> gold embrittlement. It se=
ems that the overall thick-film gold thickness will be about 25-30 microns.=
<o:p></o:p></span></p><p class=3DMsoListParagraph style=3D'text-indent:-.25=
in;mso-list:l0 level1 lfo2'><![if !supportLists]><span style=3D'font-size:1=
1.0pt;font-family:"Calibri","sans-serif";color:#1F497D'><span style=3D'mso-=
list:Ignore'>2)<span style=3D'font:7.0pt "Times New Roman"'> &nb=
sp; </span></span></span><![endif]><span style=3D'font-size:11.=
0pt;font-family:"Calibri","sans-serif";color:#1F497D'>I don’t totally=
understand the construction. I think it will be just thick-film gold=
pad applied over a gold via coming out of the bottom of the package. =
Something like 8-10 microns of gold glass (?) with 15-20 microns of thick-=
film gold over that.<o:p></o:p></span></p><p class=3DMsoNormal><span style=
=3D'font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'><o:p=
> </o:p></span></p><p class=3DMsoNormal><span style=3D'font-size:11.0p=
t;font-family:"Calibri","sans-serif";color:#1F497D'>As I said before, I hav=
e minimal experience with the thick-film process… not like plain old =
plating.<o:p></o:p></span></p><p class=3DMsoNormal><span style=3D'font-size=
:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'><o:p> </o:p>=
</span></p><p class=3DMsoNormal><span style=3D'font-size:11.0pt;font-family=
:"Arial","sans-serif";color:#1F497D'>Jim Marsico<o:p></o:p></span></p><p cl=
ass=3DMsoNormal><span style=3D'font-size:11.0pt;font-family:"Arial","sans-s=
erif";color:#1F497D'>ITT Corporation<o:p></o:p></span></p><p class=3DMsoNor=
mal><span style=3D'font-size:11.0pt;font-family:"Arial","sans-serif";color:=
#1F497D'>1500 New Horizons Blvd.<o:p></o:p></span></p><p class=3DMsoNormal>=
<span style=3D'font-size:11.0pt;font-family:"Arial","sans-serif";color:#1F4=
97D'>North Amityville, NY 11701<o:p></o:p></span></p><p class=3DMsoNormal><=
span style=3D'font-size:11.0pt;font-family:"Arial","sans-serif";color:#1F49=
7D'>631-630-5079<o:p></o:p></span></p><p class=3DMsoNormal><span style=3D'f=
ont-size:11.0pt;font-family:"Arial","sans-serif";color:#1F497D'><a href=3D"=
mailto:[log in to unmask]">[log in to unmask]</a><o:p></o:p></span></=
p><p class=3DMsoNormal><span style=3D'font-size:11.0pt;font-family:"Calibri=
","sans-serif";color:#1F497D'><o:p> </o:p></span></p><div style=3D'bor=
der:none;border-top:solid #B5C4DF 1.0pt;padding:3.0pt 0in 0in 0in'><p class=
=3DMsoNormal><b><span style=3D'font-size:10.0pt;font-family:"Tahoma","sans-=
serif"'>From:</span></b><span style=3D'font-size:10.0pt;font-family:"Tahoma=
","sans-serif"'> [log in to unmask] [mailto:ddhillma@rockwellcoll=
ins.com] <br><b>Sent:</b> Thursday, January 06, 2011 10:24 AM<br><b>To:</b>=
TechNet E-Mail Forum; Marsico, James - ES<br><b>Cc:</b> [log in to unmask]<br=
><b>Subject:</b> Re: [TN] Solder Ball Attachment to Thick Film Gold<o:p></o=
:p></span></p></div><p class=3DMsoNormal><o:p> </o:p></p><p class=3DMs=
oNormal style=3D'margin-bottom:12.0pt'><br><span style=3D'font-size:10.0pt;=
font-family:"Arial","sans-serif"'>Hi Jim - welcome back! A couple of things=
you should be concern about: (1) gold embrittlement - you need to make sur=
e that the gold content of the final solder joint is less than 3 weight % o=
r you will form a gold/tin intermetallic phase which degrades the solder jo=
int integrity; (2) dissolution of the thick film gold plating - you need to=
make sure that the soldering process doesn't completely leach/diffuse the =
thick film gold plating from the package substrate. This may not be an issu=
e depending on what type of plating is between the gold and the package sub=
strate (i.e. do you have a nickel subplating layer). </span><br><br><span s=
tyle=3D'font-size:10.0pt;font-family:"Arial","sans-serif"'>Dave Hillman</sp=
an> <br><span style=3D'font-size:10.0pt;font-family:"Arial","sans-serif"'>R=
ockwell Collins</span> <br><span style=3D'font-size:10.0pt;font-family:"Ari=
al","sans-serif"'>[log in to unmask]</span> <br><br><o:p></o:p></=
p><table class=3DMsoNormalTable border=3D0 cellpadding=3D0 width=3D"100%" s=
tyle=3D'width:100.0%'><tr><td width=3D"40%" valign=3Dtop style=3D'width:40.=
0%;padding:.75pt .75pt .75pt .75pt'><p class=3DMsoNormal><b><span style=3D'=
font-size:7.5pt;font-family:"Arial","sans-serif"'>"Marsico, James - ES=
" <[log in to unmask]></span></b><span style=3D'font-size:7.5=
pt;font-family:"Arial","sans-serif"'> </span><br><span style=3D'font-size:7=
.5pt;font-family:"Arial","sans-serif"'>Sent by: TechNet <[log in to unmask]
></span> <o:p></o:p></p><p><span style=3D'font-size:7.5pt;font-family:"A=
rial","sans-serif"'>01/06/2011 08:52 AM</span> <o:p></o:p></p><table class=
=3DMsoNormalTable border=3D1 cellpadding=3D0><tr><td valign=3Dtop style=3D'=
background:white;padding:.75pt .75pt .75pt .75pt'><p class=3DMsoNormal alig=
n=3Dcenter style=3D'text-align:center'><span style=3D'font-size:7.5pt;font-=
family:"Arial","sans-serif"'>Please respond to<br>TechNet E-Mail Forum <=
[log in to unmask]>; Please respond to<br>"Marsico, James - ES" &=
lt;[log in to unmask]></span><o:p></o:p></p></td></tr></table></td><t=
d width=3D"59%" valign=3Dtop style=3D'width:59.0%;padding:.75pt .75pt .75pt=
.75pt'><table class=3DMsoNormalTable border=3D0 cellpadding=3D0 width=3D"1=
00%" style=3D'width:100.0%'><tr><td style=3D'padding:.75pt .75pt .75pt .75p=
t'><p class=3DMsoNormal align=3Dright style=3D'text-align:right'><span styl=
e=3D'font-size:7.5pt;font-family:"Arial","sans-serif"'>To</span><o:p></o:p>=
</p></td><td valign=3Dtop style=3D'padding:.75pt .75pt .75pt .75pt'><p clas=
s=3DMsoNormal><span style=3D'font-size:7.5pt;font-family:"Arial","sans-seri=
f"'>[log in to unmask]</span> <o:p></o:p></p></td></tr><tr><td style=3D'paddin=
g:.75pt .75pt .75pt .75pt'><p class=3DMsoNormal align=3Dright style=3D'text=
-align:right'><span style=3D'font-size:7.5pt;font-family:"Arial","sans-seri=
f"'>cc</span><o:p></o:p></p></td><td valign=3Dtop style=3D'padding:.75pt .7=
5pt .75pt .75pt'></td></tr><tr><td style=3D'padding:.75pt .75pt .75pt .75pt=
'><p class=3DMsoNormal align=3Dright style=3D'text-align:right'><span style=
=3D'font-size:7.5pt;font-family:"Arial","sans-serif"'>Subject</span><o:p></=
o:p></p></td><td valign=3Dtop style=3D'padding:.75pt .75pt .75pt .75pt'><p =
class=3DMsoNormal><span style=3D'font-size:7.5pt;font-family:"Arial","sans-=
serif"'>[TN] Solder Ball Attachment to Thick Film Gold</span><o:p></o:p></p=
></td></tr></table><p class=3DMsoNormal><o:p> </o:p></p><table class=
=3DMsoNormalTable border=3D0 cellpadding=3D0><tr><td valign=3Dtop style=3D'=
padding:.75pt .75pt .75pt .75pt'></td><td valign=3Dtop style=3D'padding:.75=
pt .75pt .75pt .75pt'></td></tr></table><p class=3DMsoNormal><o:p></o:p></p=
></td></tr></table><p class=3DMsoNormal style=3D'margin-bottom:12.0pt'><br>=
<br><br><tt><span style=3D'font-size:10.0pt'>Good Day Technet:</span></tt><=
span style=3D'font-size:10.0pt;font-family:"Courier New"'><br><tt>I've been=
a way from Technet for a number of years, but now I'm glad to be back.</tt=
><br><br><tt>Not being all that familiar with the thick-film process, maybe=
someone can help. We are in the process of designing a BGA multichip=
module where we're working with a supplier who will supply the empty packa=
ge. The supplier wants to use thick-film gold for the external I/O pa=
ds, where we will be attaching solder balls after the component is assemble=
d. I have no experience soldering tin-lead solder balls to thick-film=
gold and was wondering if this is a standard practice or if we're breaking=
new ground. Although this is a developmental program, this assembly=
will eventually be flight-worthy for a military avionics project.</tt><br>=
<br><tt>Thanks in advance for your help,</tt><br><br><tt>Jim Marsico</tt><b=
r><tt>ITT Corporation</tt><br><tt>1500 New Horizons Blvd.</tt><br><tt>North=
Amityville, NY 11701</tt><br><tt>631-630-5079</tt><br><tt>James.marsico@it=
t.com<mailto:[log in to unmask]></tt><br><br><br><tt>_____________=
___________________</tt><br><tt>This e-mail and any files transmitted with =
it may be proprietary and are intended solely for the use of the individual=
or entity to whom they are addressed. If you have received this e-mail in =
error please notify the sender.</tt><br><tt>Please note that any views or o=
pinions presented in this e-mail are solely those of the author and do not =
necessarily represent those of ITT Corporation. The recipient should check =
this e-mail and any attachments for the presence of viruses. ITT accepts no=
liability for any damage caused by any virus transmitted by this e-mail.</=
tt><br><br><tt>____________________________________________________________=
__________</tt><br><tt>This email has been scanned by the MessageLabs Email=
Security System.</tt><br><tt>For more information please contact helpdesk =
at x2960 or [log in to unmask] </tt><br><tt>_________________________________=
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