Good Day Technet:
I've been a way from Technet for a number of years, but now I'm glad to be back.

Not being all that familiar with the thick-film process, maybe someone can help.  We are in the process of designing a BGA multichip module where we're working with a supplier who will supply the empty package.  The supplier wants to use thick-film gold for the external I/O pads, where we will be attaching solder balls after the component is assembled.  I have no experience soldering tin-lead solder balls to thick-film gold and was wondering if this is a standard practice or if we're breaking new ground.   Although this is a developmental program, this assembly will eventually be flight-worthy for a military avionics project.

Thanks in advance for your help,

Jim Marsico
ITT Corporation
1500 New Horizons Blvd.
North Amityville, NY 11701
631-630-5079
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