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January 2011

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Subject:
From:
John Goulet <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 28 Jan 2011 21:35:55 +0000
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text/plain
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One of the reasons for the space is to assure people are bending the lead via a tool or machine that is holding the lead at the point between the seal of the body and the bend. 

 Without the IPC standard people would be holding the body and bending the leads, stressing and cracking the seal or breaking the miniscus of capacitors. 

John Goulet 

MFG/Process Engineer 
----- Original Message ----- 
From: "Jeff Popp" <[log in to unmask]> 
To: [log in to unmask] 
Sent: Thursday, January 27, 2011 6:58:04 AM 
Subject: [TN] IPC 610 - Stress Relief 

In the 610 -rev E, clause 7.1.2.2 on page 7-9 deals with lead forming and stress relief. The first criteria mentions lead bends less than 1 lead diameter away from the body being only a process indicator for Class 2. The criteria directly below that calls No stress relief a Defect for Class 2. 

It seems a little contradictory to me. If you place a bend less than 1 lead diameter away from the seal, is that really any different than no bend whatsoever? It seems to be splitting hairs and from a practical standpoint, a little difficult to tell the difference. 

Any thoughts? 

Best Regards, 
Jeff 

Jeff Popp 
Quality Assurance Technician 
Compunetix, Inc. 
2420 Mosside Blvd. 
Monroeville, PA 15146 
(412) 858-6184 
[log in to unmask]<mailto:[log in to unmask]> 

[J-STD-001 Instructor logo 2c] 






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