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January 2011

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Subject:
From:
Phil Bavaro <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 27 Jan 2011 13:25:28 -0800
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I recently heard from a customer who is concerned about our designs
having tantalum caps on the second side of double sided Sn63Pb37 circuit
card assemblies.

 

This is news to me but maybe something has happened in the world that I
missed.....wouldn't be the first time.

 

In a nutshell, I am hearing that tantalums cannot be reflowed
twice....yet I read in Kemet literature that the reliability specs are
based on three time reflows for resistance to soldering heat.

 

And I have reflowed tantalums at lead free temperatures as well without
seeing failures.

 

Any help would be appreciated.

 

Phil

 

 


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